First Steps to Successful Use of HDI/Microvia Technologies

摘要

It's quite obvious that the drive for more handheld applications is driving electronics to continue to become denser; however, Mother Nature is playing a big role in determining the other drivers. As chip signal rise times continue to decrease (due to smaller gate geometries), the resulting signals are more susceptible to interconnect para-sitics. Further, signal integrity (SI) improves with miniaturization. All these smaller size factors are drivers for high density interconnect (HDI) with microvias.