Resolving Pad Design Defects With Destructive and Non-Destructive Methods

摘要

First, there is a correlation between 2DX Vendor A and Cross Section for QFN voids diameter. 2DX is a good Non-Destructive tool to identify QFN voids with small size (6 mils). Second, the void X-ray images for size and number do not depend on voltage and power for good 2DX machines. Third, the stencil with reducing length inward by 10 mils has higher Heel thickness solder and good solder joint, based on our experimental data. Fourth, It is good to examine QFN Heel and Toe thickness shape with an oblique angle detector with 60 degrees at 2DX. Lastly, more QFN types are needed to study for this project.