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An overview of microvia technology

机译:微孔技术概述

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There are many advantages of microvia: it requires a much smaller pad, which saves the board size an weight; with microvia, more chips can be placed in less space or a smaller PCB, which results in a low cost; An with microvia, electrical Performance improves due to a Shorter pathway. Basically, there Are five major processes for Microvia formation: NC drilling; Laser via fabrication including CO_2 Laser, YAG laser, and excimer; Photo-defined vias, wet or dry; Etch via fabrications including Chemical (Wet) etching; and Conductive ink formed vias, wet or Dry.
机译:微型通孔有很多优点:它需要的焊盘要小得多,从而节省了电路板的尺寸和重量;借助微孔,可以在更少的空间或更小的PCB中放置更多的芯片,从而降低了成本;使用微通孔时,由于路径较短,电气性能会提高。基本上,微孔形成有五个主要过程:NC钻孔;通过制造的激光,包括CO_2激光,YAG激光和准分子;光定义的通孔,湿的或干的;通过包括化学(湿法)蚀刻在内的制造工艺进行蚀刻;导电油墨形成的通孔,湿的或干的。

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