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The use of ultrasound to enable low temperature electroless plating

机译:使用超声波实现低温化学镀

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Purpose - Electroless plating is an important process in printed circuit board and electronics manufacturing but typically requires temperatures of 70-95°C to give a suitable deposition rate. This is becoming problematic in industry due to the rising price of energy and is a major contribution to production costs. Previous studies have noted beneficial effects of ultrasonic irradiation upon electroless plating processes and it has been reported that sonication can increase the plating rate and produce changes to the chemical and physical properties of the deposited coating. The purpose of this paper is to reduce the operating temperature of an electroless nickel bath by introducing ultrasound to the process. Design/methodology/approach - The deposition rate of an electroless nickel solution was determined by two techniques. In the first method, test coupons were plated in an electroless nickel solution at temperatures ranging from 50-90°C and the plating rate was calculated by weight gain. In the second approach the mixed potential (and hence the current density at the mixed potential) was determined by electrochemical analysis of the anodic and cathodic reactions. In both cases the plating rate was found with and without the application of an ultrasonic field (20 kHz). The electroless nickel deposits obtained in the plating tests were also analysed to determine the phosphorus content microhardness and brightness. Findings - The plating rates under ultrasonic agitation were always higher than under "silent" conditions. Most importantly, considering the objectives of this study, the deposition rate under sonication at 70°C was significantly higher than that found with mechanical agitation at 90°C. In addition, the results indicated that the deposits produced in an ultrasonic field had consistently lower phosphorus content, higher microhardness and were brighter than those prepared in an electroless nickel bath that was not sonicated. Originality/value - Although previous work has been performed on the effect of ultrasound on electroless plating, all these studies have been carried out at the normal operating temperature of the electroless process. In this paper, ultrasound has been applied at temperatures well below those normally used in electroless nickel deposition to determine whether sonication can enable low temperature electroless plating.
机译:目的-化学镀是印刷电路板和电子产品制造中的重要过程,但通常需要70-95°C的温度才能提供合适的沉积速率。由于能源价格的上涨,这在工业上正成为问题,并且是对生产成本的主要贡献。先前的研究已经注意到超声辐照对化学镀工艺的有益作用,并且据报道,超声处理可以提高镀覆速率并改变沉积涂层的化学和物理性质。本文的目的是通过将超声波引入工艺中来降低化学镀镍浴的工作温度。设计/方法/方法-化学镀镍溶液的沉积速率通过两种技术确定。在第一种方法中,将测试样板在50-90°C的温度范围内的化学镍溶液中镀覆,然后通过增重计算镀覆速率。在第二种方法中,通过对阳极和阴极反应进行电化学分析来确定混合电势(并由此确定混合电势下的电流密度)。在这两种情况下,在有和没有施加超声场(20 kHz)的情况下都可以发现镀覆速率。还分析了在电镀测试中获得的化学镀镍沉积物,以确定磷含量的显微硬度和亮度。发现-超声搅拌下的镀覆速率始终高于“静音”条件下的镀覆速率。最重要的是,考虑到本研究的目的,在70°C超声处理下的沉积速率明显高于在90°C进行机械搅拌时的沉积速率。此外,结果表明,与未超声处理的化学镀镍浴相比,在超声场中产生的沉积物始终具有较低的磷含量,较高的显微硬度并且更亮。原创性/价值-尽管先前已经进行过超声波对化学镀效果的研究,但所有这些研究都是在化学镀工艺的正常工作温度下进行的。在本文中,已经在远低于化学镀镍沉积中通常使用的温度的温度下应用了超声波,以确定超声处理是否可以实现低温化学镀。

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