Inorganic polymer photoresist for direct ceramic patterning by photolithography

摘要

A novel negative, inorganic polymer photoresist was demonstrated to be suitable for simple and direct fabrication of tribological SiCN-based ceramic microstructures via UV photolithography and subsequent pyrolysis at 800 ℃. Photolithography has become the mainstay for small feature patterning, in which the chemical structure of a thin photoresist is modified by radiation. Following the incredible advances in photolithography, various organic photoresists are being used in a wide range of applications such as semiconductor processing, optical circuits, microfluidic devices, and microelectromechanical systems (MEMS).