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Research on Low Temperature Epitaxial Growth of Silicon Thin Film Using Low-Energy Ion Bombardment Process

机译:低能离子轰击法低温外延生长硅薄膜

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摘要

Low temperature silicon epitaxy using a low-energy ion bombardment process (<30eV) has been investigated for several dopants (As, Al) and several ions (Ar~+, Kr~+). Carrier concentration of arsenic-doped silicon film decreased when an argon ion bombardment energy became greater than 22eV Arsenic is the highest dopant deactivated ion energy in n-type dopants (P: l3eV Sb: 9eV). The effects of ion bombardment on aluminum-doped silicon film are studied. In the case of Lrypton ion bombardment, silicon epitaxial film with fully activated dopant is grown in a wide range of ion bombardment energy compared with argon ion bombardment. This result will give us a right direction for a semiconductor manufacturing employing a ion bombardment process.
机译:对于几种掺杂剂(As,Al)和几种离子(Ar〜+,Kr〜+),采用低能离子轰击工艺(<30eV)对低温硅外延进行了研究。当氩离子轰击能量大于22eV时,掺杂砷的硅膜的载流子浓度降低。砷是n型掺杂剂中最高的掺杂剂失活离子能(P:13eV Sb:9eV)。研究了离子轰击对掺铝硅膜的影响。在L离子轰击的情况下,与氩离子轰击相比,具有完全活化的掺杂剂的硅外延膜在广泛的离子轰击能量下生长。这一结果将为我们采用离子轰击工艺的半导体制造提供正确的方向。

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