Mitsubishi Materials Sharpens Cutting of Surface-Mount IC Packages

摘要

Mitsubishi Materials Corporation has started sales of the new NMR resin bond blade, which is used to cut surface-mount type integrated circuit (IC) packages installed in digital home appliances. The NMR resin bond blade adopts a new additive material that maximizes the uniformity of resin powder in dispersion state and of diamond grains in the mixed material.