Earth-Friendly Plating Solution Passes Reliability Tests

摘要

In this article, it was confirmed that deposition of 0.07μm-thick gold film on Ni-P film and 0.05μm-thick gold film on Ni-P/Pd film is possible for gold plating performed using the EPITHAS TDS-25 cyanide-free electroless substitution type gold plating solution. It was confirmed that Ni-P/Au plating and Ni-P/Pd/Au plating provide a solder joint reliability equivalent to that of a standard cyanide bath, and the TDS-25 plating bath has superior solution stability. Furthermore, there is a potential for the application of TDS-25 in the printed circuit board field as a cyanide-free electroless substitution type gold plating solution.