Low-Stress, Thin Chip Packaging Material Lowers Substrate Warpage

摘要

This time, Panasonic has developed the MEGTRON GX Series R-G525 and R-G520 low-stress substrate materials that enable low warpage in semiconductor packages incorporated in mobile devices in recent years. As a result of warpage evaluation conducted at Panasonic, it has been confirmed that packages using R-G525 and R-G520 exhibit smaller warpage compared with packages using a commonly used low-CTE, high-modulus material. Panasonic considers that R-G525 and R-G520 are materials that have potential to be applied to a wide range of semiconductor packages that are incorporated in mobile devices down the road.