Heightened Orders Create Buzz for FC-BGA Chip Packaging Substrate

摘要

Demand for flip chip ball grid array (FC-BGA) chip packaging substrates are exploding, as data center and cloud service providers are clamoring for more of server computers to expand their service infrastructure, fueling demand for CPUs and GPUs. FC-BGA is a ground-breaking chip packaging technology designed to meld a chip on a substrate using ultra-tiny ball-type bumps. The hip packaging substrate is an ultra-thin PCB at the level of 01 .mm in thickness, which are mainly used for semiconductor chip packaging.