Flow Splitter Technology Suits Leading-Edge Chip Manufacturing Process

摘要

With the advances of miniaturization and multiple wafer layers in silicon process, the distribution of film quality on silicon wafer significantly affects the yield improvement of semiconductor device process. Improvements of distribution and throughput are required in film deposition for flat panel display (FPD) as well. Therefore, semiconductor manufacturing equipment and FPD manufacturing equipment adopt the gas supply system that controls gas distribution in the chamber by introducing gases into the process chamber through multiple flow channels. To achieve increasingly complex gas supply control, flow splitters or flow ratio controllers are often used to control the introduced gases to the desired ratios, and diverse numbers of flow channels, flow rate conditions, and high-speed flow rate splitting response performance are required.