Material for Ultra-Fine Circuits Gains Promise for Electronic Packaging

摘要

In High Resolution De-bondable Panel (HRDP) structure, a multilayer thin film is formed on the surface of the glass carrier. The ultra-thin seed layer for plating formed on a very flat substrate enables an ultra-fine redistribution layer (RDL) to be formed efficiently in a panel size of 600x600mm. It is optimal for the formation of high-density and ultra-fine circuits, contributing to the improvement of the process yield and to cost reduction. Hence, it is expected to replace flip-chip and wire-bonding packaging technologies, as well as to create new markets, such as mixed mounting of various chips.