Crack propagation in a functionally graded plate under thermal shock

摘要

Thermal cracking in a ceramic/metal functionally graded plate is discussed. When a functionally graded plate is cooled from high temperature, curved or straight crack paths are experimentally observed on the ceramic surface. One o the reasons that make the crack paths to differ are the thermal or mechanical conditions. In order to clarify the influence of these conditions on the crack path, the crack propagation is simulated using finite element method.