Crack propagation problem in a functionally graded material plate under thermal shock

摘要

This paper studies the crack propagation path in a ceramic/metal functionally graded material plate (FGP) under a transient temperature field. When the FGP is subjected to thermal shock, a single crack or multiple cracks often occur on the ceramic surface at cooling process. The crack paths are influenced by heating temperature, a compositional profile of the FGP, interaction among multiple cracks and so on. Transient thermal stresses are treated as a linear quasi-static thermoelastic problem for a plane strain state. The crack paths are obtained from Mode Ⅰ and Mode Ⅱ stress intensity factors using finite element method.