机译:压电双压电晶片Ⅲ型裂纹问题的断裂分析
State Key Laboratory of Structure Analysis of Industrial Equipment and Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, People's Republic of China;
State Key Laboratory of Structure Analysis of Industrial Equipment and Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, People's Republic of China;
State Key Laboratory of Structure Analysis of Industrial Equipment and Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, People's Republic of China;
Department of Civil and Architectural Engineering, City University of Hong Kong, Kowloon, Hong Kong;
Piezoelectric bimorph; Symplectic approach; Impermeable and permeable crack; Interface crack; Stress/electric intensity factor;
机译:用固体直接压电和壳体垫片与金属垫片薄压电双芯片的有限元分析与伪直接压电评估
机译:Timoshenko梁模型的串联压电
机译:在正极压电介质中的3D矩形透气裂缝和两个3D矩形渗透裂缝的断裂分析
机译:三层结构压电双压电晶片驱动模型的建立及基于内能分析的仿真分析
机译:流体中柔性压电双压电晶片的多物理场耦合分析方法
机译:压电双压电晶片的全厚度电势的谱元法建模
机译:压电双压电晶片的振动模式:灵敏度分析