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Finite element analysis of a thin piezoelectric bimorph with a metal shim using solid direct-piezoelectric and shell inverse-piezoelectric coupling with pseudo direct-piezoelectric evaluation

机译:用固体直接压电和壳体垫片与金属垫片薄压电双芯片的有限元分析与伪直接压电评估

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摘要

A thin triple-layer piezoelectric bender, also known as a piezoelectric bimorph with a metal shim, consists of an elastic layer (metal shim) sandwiched between two piezoelectric layers. It is one of the most commonly used piezoelectric composite structures in both sensing and actuation applications. Therefore, this study deals with the coupled piezoelectric-structure interaction analysis of a thin piezoelectric bimorph with a metal shim. In this work, the best features of the solid and shell elements were combined to analyze the piezoelectric and structural fields, respectively, in a thin piezoelectric bimorph with a metal shim. This approach addresses the shortcomings of using a single finite element mesh for both the piezoelectric and structural fields. A transformation method using the block Gauss-Seidel algorithm is employed to exchange the variables between solid direct-piezoelectric and shell inverse-piezoelectric analyses. The metal layer can be analyzed as an elastic body with electrical boundary conditions. A pseudo direct-piezoelectric evaluation method for the metal shim in the piezoelectric analysis is proposed. This method allows us to reuse the existing piezoelectric analysis program, where the metal shim is analyzed as the pseudo direct-piezoelectric material in a single analysis procedure. The homogenization method for the evaluation of bending rigidity and mass is used for modeling the single shell structure in the inverse-piezoelectric analysis of a thin piezoelectric bimorph with a metal layer. Numerical results are given for various electrical configurations of actuators and sensors to validate the present method. Comparison with an exact solution illustrates the accuracy, efficiency, and capability of the developed solid direct and shell inverse-piezoelectric analysis coupled with a pseudo direct-piezoelectric evaluation method to capture the sensor and actuator response of a thin piezoelectric bimorph with a metal shim.
机译:薄的三层压电弯,也称为具有金属垫片的压电双芯片,由夹在两个压电层之间的弹性层(金属垫)组成。它是感测和致动应用中最常用的压电复合结构之一。因此,该研究涉及用金属垫片的薄压电双芯片的耦合压电结构相互作用分析。在这项工作中,组合了固体和壳体元件的最佳特征,分别分别在具有金属垫片的薄压电双芯片中分析压电和结构领域。该方法解决了使用单个有限元网格的缺点,用于压电和结构场。采用了使用块高声-Seidel算法的变换方法来在固体直接压电和壳体反型压电分析之间交换变量。可以分析金属层作为具有电边界条件的弹性体。提出了压电分析中金属垫片的伪直接压电评估方法。该方法允许我们重复使用现有的压电分析程序,其中金属垫片在单个分析过程中被分析为伪直接压电材料。弯曲刚性和质量评价的均化方法用于用金属层对薄压电双芯片逆压电分析进行建模。给出了致动器和传感器的各种电气配置的数值结果,以验证本方法。与精确解决方案的比较说明了与伪直接压电评估方法耦合的开发的固体直接和壳逆压电分析的精度,效率和能力,以捕获用金属垫片的薄压电双芯片的传感器和致动器响应。

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