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Removal of photoresist residues and healing of defects on graphene using H_2 and CH_4 plasma

机译:使用H_2和CH_4等离子体去除光刻胶残留物并修复石墨烯上的缺陷

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Residual impurities on the surface of graphene after device fabrication degrade the performance of graphene electronic devices. It is important to solve this issue in order to use graphene in electronic devices. In this study, we removed residues using four plasma treatment methods following the photolithography process. The four plasma treatment methods were hydrogen plasma treatment (Process 1, P-1), methane plasma treatment (Process 2, P-2), hydrogen plasma pre- and methane plasma post-treatment (Process 3, P-3), and hydrogen-methane mixed plasma treatment (Process 4, P-4). The results were analyzed using atomic force microscopy and Raman spectroscopy. Of the four treatments, Process 4 showed the most remarkable removal of photoresist residue and healing of the damaged graphene film, thereby improving the mobility of the graphene. The total resistance of the graphene channel in the device was also considerably reduced. These results reveal that a hydrogen-methane mixed plasma treatment (P-4) could be a powerful method for removing residue on the surface of graphene after the lithography process.
机译:器件制造后,石墨烯表面上的残留杂质会降低石墨烯电子器件的性能。为了在电子设备中使用石墨烯,解决此问题很重要。在这项研究中,我们在光刻工艺之后使用四种等离子体处理方法去除了残留物。四种等离子体处理方法分别为氢等离子体处理(过程1,P-1),甲烷等离子体处理(过程2,P-2),氢等离子体预处理和甲烷等离子体后处理(过程3,P-3),以及氢-甲烷混合等离子体处理(工艺4,P-4)。使用原子力显微镜和拉曼光谱分析结果。在这四种处理中,方法4显示出最显着的光致抗蚀剂残留去除和受损石墨烯薄膜的修复,从而提高了石墨烯的迁移率。器件中石墨烯通道的总电阻也大大降低。这些结果表明,氢-甲烷混合等离子体处理(P-4)可能是在光刻工艺之后去除石墨烯表面残留物的有效方法。

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