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Simultaneous characterization of bulk impurities and interface states by photocurrent measurements

机译:通过光电流测量同时表征大部分杂质和界面态

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A new method for evaluating both surface recombination velocity and bulk minority carrier lifetime by photocurrent measurements is discussed and validated by comparison with capacitance-voltage measurements of interface state density. This method is an evolution of the measurement of surface recombination velocity by the Elymat technique, it does not require the oxide to be etched off and consists in measurements of surface recombination velocity under an applied surface bias. The application of a surface bias allows the control of the interface potential and the identification of the suitable interface condition so that surface recombination velocity can be considered as a measurement of interface state density.In addition, it is shown that surface recombination velocity is suppressed when the surface is under accumulation conditions, so the application of a surface bias provides the possibility of a surface passivation by driving the surface into accumulation. This passivation by surface polarization is about as effective as the chemical passivation by HF. Finally, the dependence of surface recombination velocity on the injection level is shown to be reversed when the interface changes from depletion to accumulation or inversion conditions. This technique does not require the formation of a capacitor structure, so it is suitable for the measurement of as-grown inter-face properties. For this reason, this technique was chosen for a systematic study of the nitridation process of oxide films. Surface recombination velocity was correlated with nitrogen concentration at the oxide-silicon interface. (C) 2004 Elsevier B.V. All rights reserved.
机译:讨论了一种通过光电流测量来评估表面复合速度和整体少数载流子寿命的新方法,并通过与界面态密度的电容电压测量结果进行比较来验证该方法。该方法是通过Elymat技术测量表面复合速度的一种演变,它不需要蚀刻掉氧化物,而在于在施加的表面偏压下测量表面复合速度。表面偏压的施加可以控制界面电势并确定合适的界面条件,因此可以将表面复合速度视为界面态密度的量度。由于表面处于累积条件下,因此施加表面偏压可通过驱动表面进入累积来提供表面钝化的可能性。通过表面极化进行的钝化与通过HF进行化学钝化的效果差不多。最后,当界面从耗竭状态向堆积状态或反转状态变化时,表面重组速度对注入水平的依赖性被证明是相反的。该技术不需要形成电容器结构,因此适用于已生长的界面性能的测量。因此,选择该技术用于系统研究氧化膜的氮化过程。表面复合速度与氧化物-硅界面处的氮浓度相关。 (C)2004 Elsevier B.V.保留所有权利。

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