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Study of HfO_2 thin films prepared by electron beam evaporation

机译:电子束蒸发制备HfO_2薄膜的研究

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The purpose of this paper is to report some experiments with HfO_2 film, which was deposited onto silicon substrates at different growth rates by electron beam evaporation. The chemical states were measured by X-ray photoelectron spectroscopy (XPS). The rms roughness as low as 0.85 nm was measured by atomic force microscope (AFM). Scanning electron microscopy (SEM) was also used to determine cross-section morphology. Spectroscopic ellipsometry (SE) was applied to measure the refractive index, extinction coefficient and the thickness of the films. The results of SE presented the refractive indices varied in the range of 1.81-1.95 around 1550 nm by altering deposition rates. The transmittance and reflectance spectrum were measured to determine the effectiveness of HfO_2 thin film as a single layer anti-reflection coating on Si substrates. The results suggested that the Fresnel losses below 0.05 dB/chip are achieved by depositing HfO_2 film onto SOI rib waveguide endface.
机译:本文的目的是报告一些HfO_2膜的实验,该膜通过电子束蒸发以不同的生长速率沉积在硅衬底上。化学状态通过X射线光电子能谱法(XPS)测量。通过原子力显微镜(AFM)测量的均方根粗糙度低至0.85 nm。扫描电子显微镜(SEM)也用于确定横截面形态。椭圆偏振光谱法(SE)用于测量折射率,消光系数和膜的厚度。 SE的结果表明,通过改变沉积速率,折射率在1550nm附近在1.81-1.95的范围内变化。测量透射率和反射光谱以确定HfO_2薄膜作为Si基板上单层抗反射涂层的有效性。结果表明,通过在SOI肋形波导端面上沉积HfO_2薄膜,可实现低于0.05 dB /芯片的菲涅耳损耗。

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