Interaction of anti-adhesive silicone films with UV embossing resin

摘要

The durability of two silicone films, which were formed from silicone-based release agents with different molecular weights (MW), as anti-adhesive coatings for molds used for UV embossing was investigated. Flat electroless nickel-plated polyester stamp and UV-curable polyethylene glycol diacrylate (PEGDA) were the mold and molding material, respectively. The surface chemical composition of the silicone films and the PEGDA moldings was analyzed by X-ray photoelectron spectroscopy (XPS) as a function of molding times using the same nickelized polyester stamp. Silicone transfer was found to occur from the silicone films to the moldings with increased number of moldings. The silicone film formed from the release agent with the higher MW had the poorer durability. Two mechanisms are proposed for the material transfer.