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Influence of carrier gas pressure and flow rate on atomic layer deposition of HfO2 and ZrO2 thin films

机译:载气压力和流速对HfO2和ZrO2薄膜原子层沉积的影响

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Influence of the carrier gas on HfCl4-H2O and ZrCl4-H2O atomic layer processes was investigated. The growth rates of HfO2 and ZrO2 decreased with increasing flow rate and pressure of the N-2 carrier gas. Data of real-time quartz crystal microbalance measurements demonstrated that the effect observed was mainly due to influence of carrier gas on surface reactions and the role of overlapping the precursor pulses was negligible. At the same increase of the carrier gas mass flow, the increase of the linear flow rate led to more significant changes of thin-film properties than the increase of the carrier gas pressure did. Thin films with higher density, higher refractive index and, particularly, lower concentration of residual chlorine were obtained at higher carrier gas flow rates. Increase of the carrier gas flow rate also resulted in a higher concentration of a metastable phase in HfO2 thin films deposited at 300 degrees C. (c) 2005 Elsevier B.V. All rights reserved.
机译:研究了载气对HfCl4-H2O和ZrCl4-H2O原子层过程的影响。 HfO2和ZrO2的生长速率随着N-2载气的流量和压力的增加而降低。实时石英晶体微量天平测量的数据表明,观察到的影响主要是由于载气对表面反应的影响,而与前驱脉冲重叠的作用可忽略不计。在载气质量流量增加的同时,线性流速的增加导致薄膜性能的变化比载气压力的增加更为显着。在较高的载气流速下,可获得具有较高密度,较高折射率,尤其是较低浓度的残留氯的薄膜。载气流速的增加还导致在300摄氏度下沉积的HfO2薄膜中亚稳相的浓度更高。(c)2005 Elsevier B.V.保留所有权利。

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