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Properties of dc magnetron sputtered Cu_2O films prepared at different sputtering pressures

机译:在不同溅射压力下制备的直流磁控溅射Cu_2O薄膜的性能

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摘要

The sputtering pressures maintained during the deposition of Cu_2O films, by dc reactive magnetron sputtering, influence the structural, electrical and optical properties. The crystalline orientation mainly depends on the sputtering pressure. The films deposited at a sputtering pressure of 4 Pa showed single-phase Cu_2O films along (1 1 1) direction. The electrical resistivity of the films increased from 1.1 × 10~1 Ω cm to 3.2 × 10~3 Ω cm. The transmittance of the films increased from 69% to 88% with the increase of sputtering pressure from 2.5 Pa to 8 Pa.
机译:通过直流反应磁控溅射在Cu_2O膜沉积过程中保持的溅射压力会影响结构,电学和光学性能。结晶取向主要取决于溅射压力。在4 Pa的溅射压力下沉积的薄膜沿(1 1 1)方向显示单相Cu_2O薄膜。薄膜的电阻率从1.1×10〜1Ωcm增加到3.2×10〜3Ωcm。随着溅射压力从2.5 Pa增加到8 Pa,薄膜的透射率从69%增加到88%。

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