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Optical and electrical properties of plasma-oxidation derived HfO_2 gate dielectric films

机译:等离子体氧化衍生的HfO_2栅极介电膜的光电性能

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High-k gate dielectric HfO_2 thin films have been deposited on Si( 1 0 0) by using plasma oxidation of sputtered metallic Hf thin films. The optical and electrical properties in relation to postdeposition annealing temperatures are investigated by spectroscopic ellipsometry (SE) and capacitance-voltage (C-V) characteristics in detail. X-ray diffraction (XRD) measurement shows that the as-deposited HfO_2 films are basically amorphous. Based on a parameterized Tauc-Lorentz dispersion mode, excellent agreement has been found between the experimental and the simulated spectra, and the optical constants of the as-deposited and annealed films related to the annealing temperature are systematically extracted. Increases in the refractive index n and extinction coefficient k, with increasing annealing temperature are observed due to the formation of more closely packed thin films and the enhancement of scattering effect in the targeted HfO_2 film. Change of the complex dielectric function and reduction of optical band gap with an increase in annealing temperature are discussed. The extracted direct band gap related to the structure varies from 5.77, 5.65, and 5.56 eV for the as-deposited and annealed thin films at 700 and 800 ℃, respectively. It has been found from the C-V measurement the decrease of accumulation capacitance values upon annealing, which can be contributed to the growth of the interfacial layer with lower dielectric constant upon postannealing. The flat-band voltage shifts negatively due to positive charge generated during postannealing.
机译:高k栅极电介质HfO_2薄膜已通过溅射金属Hf薄膜的等离子体氧化沉积在Si(1 0 0)上。通过椭圆偏振光谱(SE)和电容-电压(C-V)特性详细研究了与沉积后退火温度有关的光学和电学性质。 X射线衍射(XRD)测量表明,所沉积的HfO_2膜基本上是非晶的。基于参数化的Tauc-Lorentz色散模式,在实验光谱和模拟光谱之间找到了极好的一致性,并且系统地提取了与退火温度相关的沉积和退火薄膜的光学常数。观察到随着退火温度的升高,折射率n和消光系数k的增加,这是由于形成了更紧密堆积的薄膜以及目标HfO_2膜中散射效应的增强。讨论了随着退火温度的升高,复介电函数的变化以及光带隙的减小。所提取的与结构有关的直接带隙分别在700和800℃下分别为5.77 e,5.65 e和5.56 eV。从C-V测量中发现,退火时累积电容值降低,这可能有助于后退火时介电常数较低的界面层的生长。由于后退火过程中产生的正电荷,平带电压产生负向偏移。

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