机译:持续电场下湿度对压痕裂纹亚临界裂纹扩展的影响
Key lab of Environment Fracture, University of Science and Technology Beijing, Beijing 100083, China;
Key lab of Environment Fracture, University of Science and Technology Beijing, Beijing 100083, China;
Key lab of Environment Fracture, University of Science and Technology Beijing, Beijing 100083, China;
Key lab of Environment Fracture, University of Science and Technology Beijing, Beijing 100083, China;
Key lab of Environment Fracture, University of Science and Technology Beijing, Beijing 100083, China;
Key lab of Environment Fracture, University of Science and Technology Beijing, Beijing 100083, China;
humidity; subcritical crack growth; indentation crack; PZT ceramics;
机译:在施加的静态和振荡电场下,非极化和极化PZT陶瓷的亚临界裂纹扩展。二。基于K-V曲线的理论分析
机译:在施加的静态和振荡电场下,非极化和极化PZT陶瓷的亚临界裂纹扩展。一,实验观察
机译:电场和残余应力对PZT-5H铁电陶瓷压痕裂纹扩展的综合影响
机译:铁电陶瓷持续电场压痕裂纹延迟传播湿度的影响
机译:形状记忆陶瓷裂纹增长的相现场建模
机译:用断裂力学和分形术分析牙科陶瓷亚临界裂纹的扩展
机译:pZT-5H铁电陶瓷在持续负荷下空气和水中压痕裂纹扩展的各向异性
机译:电场对所选介质玻璃和陶瓷亚临界裂纹扩展的影响