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Fabrication And Electrical Properties Of Metal-coated Acrylate Rubber Microspheres By Electroless Plating

机译:化学镀金属包覆丙烯酸酯橡胶微球的制备及电性能

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Electroless copper plating on micron-scale acrylate rubber (ACM) microspheres was studied. The core-shell structured Cu-coated ACM microspheres with high conductivity and low density were fabricated by introducing a reaction control method. Via multi-times activating treatment, the acrylate rubber (ACM) microspheres were implanted with more Ag catalytic active centers on the surfaces to promote the formation of coatings. The surface-coating structures and the electrical properties of Cu-coated ACM microspheres were investigated. It was found that the Cu-coated ACM microspheres were a kind of elastic particles. The different coating structures could be produced by controlling the extent of plating reaction. The coated microspheres with different coating structures were conductive, and their volume resistivities decreased remarkably with the increasing of applied pressure and varied with the temperature according to their surface coating structures.
机译:研究了微米级丙烯酸酯橡胶(ACM)微球上的化学镀铜。通过引入反应控制方法,制备了具有高电导率和低密度的核-壳结构的铜包覆的ACM微球。通过多次活化处理,丙烯酸酯橡胶(ACM)微球在表面植入了更多的Ag催化活性中心,以促进涂层的形成。研究了铜包覆的ACM微球的表面包覆结构和电性能。发现铜包覆的ACM微球是一种弹性颗粒。通过控制电镀反应的程度可以产生不同的涂层结构。具有不同涂层结构的涂层微球具有导电性,其体积电阻率随着施加压力的增加而显着降低,并随温度的变化而变化。

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