机译:MgO单晶衬底化学机械抛光过程中凹坑的产生和去除
Key Laboratory for Precision & Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, Potsdam, NY 13699, USA;
Key Laboratory for Precision & Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
Key Laboratory for Precision & Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China;
MgO single crystal substrate; chemical mechanical polishing; chemical etching; pit;
机译:化学机械抛光法去除Mgo单晶衬底表面的划痕
机译:机械和化学抛光方法处理的IIa型单晶金刚石的抛光机理和表面损伤分析
机译:MgO单晶衬底研磨或抛光过程中三角形断裂缺陷的理论分析和实验验证
机译:MgO单晶衬底三角形断裂缺陷在研磨或抛光过程中的理论分析及实验验证
机译:在化学机械抛光和晶圆清洁过程中,亚微米颗粒的粘附和去除。
机译:超声化学机械抛光与超声研磨相结合的单晶碳化硅晶片材料去除及表面生成研究
机译:基于创新概念的新型化学机械抛光/等离子体 - 化学汽化加工(CMP / P-CVM)综合加工难压晶体
机译:正电子湮没法测定机械抛光铁单晶的位错密度分布