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机译:使用通过SAM改性化学镀和电子束蒸发沉积的Cu种子层完全填充41 nm沟槽图案
Division of Materials Science and Engineering, Hanyang University, Seoul, 133-791, South Korea;
Division of Materials Science and Engineering, Hanyang University, Seoul, 133-791, South Korea;
Division of Materials Science and Engineering, Hanyang University, Seoul, 133-791, South Korea;
Division of Materials Science and Engineering, Hanyang University, Seoul, 133-791, South Korea;
Division of Materials Science and Engineering, Hanyang University, Seoul, 133-791, South Korea;
R&D Divisions, Hynix Semiconductor Inc., San 136-1 Ami-ri Bubal-eub, Icheon-Si, Kyoungki-do, 467-701, South Korea;
R&D Divisions, Hynix Semiconductor Inc., San 136-1 Ami-ri Bubal-eub, Icheon-Si, Kyoungki-do, 467-701, South Korea;
R&D Divisions, Hynix Semiconductor Inc., San 136-1 Ami-ri Bubal-eub, Icheon-Si, Kyoungki-do, 467-701, South Korea;
R&D Divisions, Hynix Semiconductor Inc., San 136-1 Ami-ri Bubal-eub, Icheon-Si, Kyoungki-do, 467-701, South Korea;
Division of Materials Science and Engineering, Hanyang University, Seoul, 133-791, South Korea;
electroplating; self-assembled monolayer; gap-filling capability; 41 nm trench pattern;
机译:自组装单层膜修饰的60 nm沟槽图案上的铜籽晶层的保形化学沉积
机译:通过自组装单层工艺在铜籽晶层上进行铜电沉积来填充60 nm沟槽图案
机译:通过自组装单层(sam)工艺在60nm沟槽图案化的Sio_2衬底上制备Cu种子层并进行表征
机译:通过化学层施加的电镀涂层在细孔中形成10nm连续Cu膜
机译:电子束图案化的自组装单层作为模板用于铜的电沉积和剥离
机译:通过选择性化学镀在新的有机皮层上的选择性化学层直接图案化铜