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Electronic interface properties of silicon substrates after ozone based wet-chemical oxidation studied by SPV measurements

机译:通过SPV测量研究基于臭氧的湿化学氧化后硅衬底的电子界面特性

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The preparation of ultra-thin oxide layers on mono-crystalline silicon substrate surfaces with ozone dissolved in ultra pure water at ambient temperature was investigated as a low cost alternative to current wet-chemical cleaning and passivation processes in solar cell manufacturing. Surface photovolt-age technique was applied as fast, nondestructive, and surface sensitive method, to provide detailed information about the influence of oxidation rate and substrate surface morphology on electronic properties of the oxidised silicon interfaces and subsequently prepared hydrogen terminated surfaces. Sequences of wet-chemical oxidation in ozone containing ultra pure water and subsequent oxide removal in diluted hydrofluoric acid solution could be utilised to prepare hydrophobic substrates, which are predominantly required as starting point for layer deposition and contact formation. On so prepared hydrogen-terminated substrates values of interface state densities D_(it,min) ≈ 5 ×10~(11) eV~(-1) cm~(-2) could be achieved, comparable to values obtained on the same substrates by the standard RCA process followed by HF dip.
机译:研究了在环境温度下用溶解在超纯水中的臭氧在单晶硅衬底表面上制备超薄氧化层的方法,作为太阳能电池生产中当前湿化学清洁和钝化工艺的一种低成本替代方案。应用表面光伏技术作为一种快速,无损和表面敏感的方法,以提供有关氧化速率和衬底表面形态对氧化硅界面和随后制备的氢封端表面的电子性能的影响的详细信息。可以使用在含有超纯水的臭氧中进行湿化学氧化的顺序,以及随后在稀氢氟酸溶液中去除氧化物的顺序,以制备疏水性基材,这些基材主要需要用作层沉积和接触形成的起点。在如此制备的氢封端的基板上,可以实现界面态密度D_(it,min)≈5×10〜(11)eV〜(-1)cm〜(-2)的值,与在相同基板上获得的值相当通过标准的RCA工艺,然后进行HF浸渍。

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