...
首页> 外文期刊>Applied Surface Science >Controlling the antibacterial activity of CuSn thin films by varying the contents of Sn
【24h】

Controlling the antibacterial activity of CuSn thin films by varying the contents of Sn

机译:通过改变锡​​的含量来控制CuSn薄膜的抗菌活性

获取原文
获取原文并翻译 | 示例

摘要

We investigated antibacterial activity of CuSn thin films against Gram positive Staphylococcus aureus (S. aureus). CuSn thin films with different Cu to Sn ratios were deposited on Si(100) by radio frequency (RF) magnetron sputtering method using Cu and Sn metal anodes. The film thickness was fixed at 200 nm by varying the sputtering time and RF power on the metal targets. The antibacterial test was conducted in various conditions such as different contact times and Cu to Sn ratios in the CuSn films. The antibacterial activities of CuSn thin films increased as the ratio of Cu and the contact time between the film and bacteria suspension increased execpt in the case of CuSn-83. The oxidation states of Cu and Sn and the chemical composition of CuSn thin films before and after the antibacterial test were investigated by X-ray photoelectron spectroscopy (XPS). When the contact time was fixed, the Cu species was further oxidized as the RF power on Cu target increased. The intensity of Sn 3d decreased with increasing Cu ratio. When the sample was fixed, the peak intensity of Sn 3d decreased as the contact time increased due to the permeation of Sn into the cell. (C) 2016 Elsevier B.V. All rights reserved.
机译:我们调查了CuSn薄膜对革兰氏阳性金黄色葡萄球菌(金黄色葡萄球菌)的抗菌活性。通过使用铜和锡金属阳极的射频(RF)磁控溅射方法,将具有不同铜锡比的CuSn薄膜沉积在Si(100)上。通过改变金属靶上的溅射时间和RF功率,将膜厚固定在200 nm。在各种条件下(例如,CuSn膜中的不同接触时间和Cu与Sn的比率)进行了抗菌测试。对于CuSn-83,CuSn薄膜的抗菌活性随Cu的比例增加以及薄膜与细菌悬浮液之间的接触时间增加而增加。用X射线光电子能谱(XPS)研究了抗菌试验前后Cu和Sn的氧化态以及CuSn薄膜的化学组成。当接触时间固定时,随着对铜靶的射频功率增加,铜物质进一步被氧化。 Sn 3d的强度随Cu比的增加而降低。固定样品后,由于Sn渗透到电池中,接触时间增加,Sn 3d的峰强度降低。 (C)2016 Elsevier B.V.保留所有权利。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号