首页> 外文期刊>Applied Surface Science >Investigation of 'surface donors' in Al2O3/AlGaN/GaN metal-oxide-semiconductor heterostructures: Correlation of electrical, structural, and chemical properties
【24h】

Investigation of 'surface donors' in Al2O3/AlGaN/GaN metal-oxide-semiconductor heterostructures: Correlation of electrical, structural, and chemical properties

机译:Al2O3 / AlGaN / GaN金属氧化物半导体异质结构中“表面施主”的研究:电,结构和化学性质的关联

获取原文
获取原文并翻译 | 示例
       

摘要

III-N surface polarization compensating charge referred here to as 'surface donors' (SD) was analyzed in Al2O3/AlGaN/GaN metal-oxide-semiconductor (MOS) heterojunctions using scaled oxide films grown by metal-organic chemical vapor deposition at 600 degrees C. We systematically investigated impact of HCl pre-treatment prior to oxide deposition and post-deposition annealing (PDA) at 700 degrees C. SD density was reduced down to 1.9 x 10(13) cm(-2) by skipping HCl pre-treatment step as compared to 3.3 x 10(13) cm(-2) for structures with HCl pre-treatment followed by PDA. The nature and origin of SD was then analyzed based on the correlation between electrical, micro-structural, and chemical properties of the Al2O3/GaN interfaces with different SD density (N-SD). From the comparison between distributions of interface traps of MOS heterojunction with different N-SD, it is demonstrated that SD cannot be attributed to interface trapped charge. Instead, variation in the integrity of the GaOx interlayer confirmed by X-ray photoelectron spectroscopy is well correlated with N-SD, indicating SD maybe formed by border traps at the Al2O3/GaOx interface. (C) 2017 Elsevier B.V. All rights reserved.
机译:在Al2O3 / AlGaN / GaN金属氧化物半导体(MOS)异质结中使用通过有机金属化学气相沉积在600度下生长的成比例氧化膜分析了III-N表面极化补偿电荷(这里称为``表面施主'') C.我们系统地研究了在700摄氏度下进行氧化物沉积和沉积后退火(PDA)之前HCl预处理的影响。通过跳过HCl预处理,SD密度降低至1.9 x 10(13)cm(-2)。处理步骤,而采用HCl预处理并随后进行PDA的结构则为3.3 x 10(13)cm(-2)。然后,根据具有不同SD密度(N-SD)的Al2O3 / GaN界面的电学,微观结构和化学性质之间的相关性,分析SD的性质和起源。通过比较不同N-SD的MOS异质结界面陷阱的分布,可以证明SD不能归因于界面陷阱电荷。取而代之的是,通过X射线光电子能谱证实的GaOx中间层完整性的变化与N-SD密切相关,这表明SD可能是由Al2O3 / GaOx界面处的边界陷阱形成的。 (C)2017 Elsevier B.V.保留所有权利。

著录项

  • 来源
    《Applied Surface Science》 |2017年第31期|656-661|共6页
  • 作者单位

    Slovak Acad Sci, Inst Elect Engn, Dubravska Cesta 9, Bratislava 84104, Slovakia;

    Slovak Acad Sci, Inst Elect Engn, Dubravska Cesta 9, Bratislava 84104, Slovakia;

    Slovak Acad Sci, Inst Elect Engn, Dubravska Cesta 9, Bratislava 84104, Slovakia;

    Slovak Acad Sci, Inst Elect Engn, Dubravska Cesta 9, Bratislava 84104, Slovakia;

    Slovak Acad Sci, Inst Elect Engn, Dubravska Cesta 9, Bratislava 84104, Slovakia;

    Slovak Acad Sci, Inst Elect Engn, Dubravska Cesta 9, Bratislava 84104, Slovakia;

    Slovak Acad Sci, Inst Elect Engn, Dubravska Cesta 9, Bratislava 84104, Slovakia;

    MTA EK, Inst Tech Phys & Mat Sci, Konkoly TM Ut 29-33, H-1121 Budapest, Hungary;

    MTA EK, Inst Tech Phys & Mat Sci, Konkoly TM Ut 29-33, H-1121 Budapest, Hungary;

    Ferdinand Braun Inst, Leibniz Inst Hochstfrequenztech, Gustav Kirchhoff Str 4, D-12489 Berlin, Germany;

    Slovak Acad Sci, Inst Elect Engn, Dubravska Cesta 9, Bratislava 84104, Slovakia;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    AlGaN/GaN; MOS-HEMT; Surface donors; Interface states;

    机译:AlGaN / GaN;MOS-HEMT;表面施主;界面态;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号