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首页> 外文期刊>IEEE Transactions on Applied Superconductivity >Performance measurements of a superconductive microprobe for eddy current evaluation of subsurface flaws
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Performance measurements of a superconductive microprobe for eddy current evaluation of subsurface flaws

机译:超导体微探针性能测量,用于涡流评估表面缺陷

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摘要

First measurements of the performance of the superconductive microprobe show that its depth of field and resolution are far superior to those of conventional eddy-current probes. It is shown that the superconductive microprobe can detect millimeter-size flaws to depths of 5 mm in 2024 aluminum. It also easily detects a 1.4% loss in material owing to corrosion at the bond line of two 2.29-mm-thick, 7075 aluminum plates. The corrosion patch is 15.9 mm in diameter. The prototype shows three main limitations: standoff distance, electronic noise in the feedback circuitry, and interference from fluctuations in tilt while scanning a test surface. Decreasing the size of the pickup loops and source coil can decrease both the standoff distance and interference from tilt. Using digital circuitry can suppress the noise of feedback circuitry.
机译:对超导微探针性能的首次测量表明,它的景深和分辨率远远优于传统的涡流探头。结果表明,超导电微探针可以检测2024铝中5毫米深度的毫米级缺陷。它还很容易检测到由于在两块2.29毫米厚的7075铝板的粘结线上的腐蚀而造成的材料损失1.4%。腐蚀斑的直径为15.9毫米。该原型显示出三个主要限制:隔离距离,反馈电路中的电子噪声以及扫描测试表面时倾斜波动的干扰。减小拾波环和源线圈的尺寸可以减小隔离距离和倾斜干扰。使用数字电路可以抑制反馈电路的噪声。

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