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The microstructure and microchemistry of high critical current Nb/sub 3/Sn strands manufactured by the bronze, internal-Sn and PIT techniques

机译:通过青铜,内部Sn和PIT技术制造的高临界电流Nb / sub 3 / Sn股线的组织和化学性质

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Recent advances in Nb/sub 3/Sn conductor development have advanced the non-Cu critical current density, J/sub c/, from 2000 A/mm/sup 2/ to almost 3000 A/mm/sup 2/ (12 T, 4.2 K). We have quantified a variety of state of the art composites for their microstructures using the fracture/field emission scanning electron microscope, FESEM, technique and their microchemistry using energy dispersive X-ray spectroscopy (EDS)/FESEM. The results of the measurements increasingly point to the importance of A15 composition in determining the critical current density as well as grain size. The highest critical current densities, however, are being attained by the internal Sn process which has yet to achieve as high a level of Sn (23-24.5 at.% Sn) in the A15 as for powder-in-tube (PIT) in which we measure as high as 25-26 at.% Sn. When Sn diffuses into the Cu stabilizer, it is found to have a great affinity for Nb/sub 3/Sn formation than dissolution into the Cu. A15 forms at the Nb-stabilizer surface with local Cu concentrations within the grains of the stabilizer of less than 0.1 at.% Cu. Elevated levels of Sn, however, were observed at the Cu grain boundaries. Both the quantified variations in composition and the peak levels of Sn indicate that further increases in performance should be expected.
机译:Nb / sub 3 / Sn导体发展的最新进展已将非Cu临界电流密度J / sub c /从2000 A / mm / sup 2 /提高到将近3000 A / mm / sup 2 /(12 T, 4.2 K)。我们已经使用断裂/场发射扫描电子显微镜,FESEM,技术及其使用能量色散X射线能谱(EDS)/ FESEM的微化学方法对各种复合材料的微观结构进行了量化。测量结果越来越多地指出了A15成分在确定临界电流密度和晶粒尺寸方面的重要性。然而,通过内部Sn工艺可以实现最高的临界电流密度,该工艺还没有达到A15中的粉管内(PIT)级别的Sn(23-24.5 at。%Sn)的水平。我们测得的锡含量高达25-26 at。%。当Sn扩散到Cu稳定剂中时,发现它对Nb / sub 3 / Sn的形成具有比溶解在Cu中更大的亲和力。 A15在Nb稳定剂表面形成,稳定剂晶粒内的局部Cu浓度小于0.1 at。%Cu。然而,在铜晶界处观察到锡的水平升高。成分的定量变化和Sn的峰值水平均表明应预期性能会进一步提高。

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