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Investigation of Three-Dimensional Current Distribution at Silver Diffusion Joint of RE-123 Coated Conductors Based on Magnetic Microscopy Combined With Finite Element Method

机译:电磁显微镜结合有限元法研究RE-123涂层导体银扩散缝处的三维电流分布

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摘要

Combining scanning Hall-probe microscopy (SHPM) with finite element method (FEM), we have investigated three-dimensional current distribution at a silver diffusion joint of RE-123 coated conductor (CC). This research aims at the understanding of electromagnetic behaviors in a jointed CC and at the establishment of an analysis model for it. Two-dimensional distribution of sheet current density in a jointed sample was visualized by a SHPM measurement with a spatial resolution of a few hundred micrometers. Then, it was found that such a distribution included information about current transfer between the jointed pieces. Furthermore, the experimental results were successfully reconstructed by a three-dimensional FEM analysis. We believe that these will be very important findings for the establishment of jointing processes on CCs and for the designs of practical applications which need such processes.
机译:结合扫描霍尔探针显微镜(SHPM)和有限元方法(FEM),我们研究了RE-123涂层导体(CC)的银扩散缝处的三维电流分布。这项研究旨在了解联合CC中的电磁行为,并为此建立分析模型。通过具有几百微米空间分辨率的SHPM测量,可以观察到接合样品中薄板电流密度的二维分布。然后,发现这种分布包括关于接合件之间的电流传递的信息。此外,通过三维有限元分析成功地重建了实验结果。我们认为,这对于在CC上建立连接过程以及需要这种过程的实际应用设计将是非常重要的发现。

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