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Femtosecond laser micromachining of grooves in indium phosphide

机译:飞秒激光微加工磷化铟中的沟槽

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摘要

Femtosecond laser micromachining of indium phosphide is investigated using 150 fs light pulses at a center wavelength of 800 nm. The ablation rate for micromachining of grooves is investigated as a function of pulse energy, feed rate, number of passes over the same groove, and the light polarization relative to the cutting direction. A logarithmic dependence of the groove depth on the laser fluence is observed with two regimes characterized by different ablation rates and different thresholds. The groove depth is found to be inversely proportional to the feed rate or equivalently linearly proportional to number of pulses delivered per unit area. With multiple passes over the same groove the depth increases linearly up to about 20 consecutive passes. Above 20 passes the ablation rate decreases until a depth limit is approached. The best results in terms of groove geometry and depth limit are obtained with the polarization of the beam perpendicular to the cutting direction.
机译:使用中心频率为800 nm的150 fs光脉冲研究了磷化铟的飞秒激光微加工。根据脉冲能量,进给速率,在同一凹槽上通过的次数以及相对于切割方向的光偏振,研究了凹槽微加工的烧蚀速率。观察到凹槽深度对激光通量的对数依赖性,这两种特征的特征在于不同的烧蚀速率和不同的阈值。发现凹槽深度与进给速度成反比,或者与每单位面积传送的脉冲数成线性成正比。在同一凹槽上进行多次加工后,深度会线性增加,直至大约连续20次。大于20时,消融速率会降低,直到达到深度极限为止。在光束的偏振方向垂直于切割方向的情况下,可获得最佳的凹槽几何形状和深度限制结果。

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