首页> 外国专利> Method for fabricating indium phosphide/indium gallium arsenide phosphide buried heterostructure semiconductor lasers

Method for fabricating indium phosphide/indium gallium arsenide phosphide buried heterostructure semiconductor lasers

机译:磷化铟/砷化铟镓磷化物掩埋异质结构半导体激光器的制造方法

摘要

A semiconductor laser having a high modulation bandwidth is made by utilizing an InGaAsP cap layer and an InGaAsP active layer of different crystal structure. Channels are anisotropically etched through the cap, cladding and active layers and partially through the buffer layer. The active and cap layers a laterally etched and a semi-insulating material is overlaid the sidewalls. A further etching leaves a thin wall of the semi-insulating material surrounding the active layer. 1.3 &mgr;m InGaAsP lasers with 3 dB bandwidths of 24 GHz and intrinsic resonance frequencies in excess of 22 GHz have been successfully fabricated. This is the highest bandwidth ever reported for a semiconductor laser, and the highest resonance frequency for InGaAsP lasers. Excellent modulation efficiencies are observed to high frequencies.
机译:通过利用具有不同晶体结构的InGaAsP覆盖层和InGaAsP有源层来制造具有高调制带宽的半导体激光器。穿过盖,包层和有源层并且部分穿过缓冲层来各向异性地蚀刻沟道。有源层和盖层被横向蚀刻并且半绝缘材料覆盖在侧壁上。进一步的蚀刻使半绝缘材料的薄壁围绕有源层。已经成功地制造出具有3 dB带宽,24 GHz且固有共振频率超过22 GHz的1.3μmInGaAsP激光器。对于半导体激光器,这是有史以来最高的带宽,对于InGaAsP激光器,这是最高的谐振频率。在高频下观察到极好的调制效率。

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