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MIS-TSC: A combination of the thermally stimulated current method and a metal-insulator-semiconductor device for unipolar trap spectroscopy

机译:MIS-TSC:热激电流方法与用于单极阱光谱的金属-绝缘体-半导体器件的组合

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摘要

To determine the density of states distribution of traps within a semiconductor, the thermally stimulated current (TSC) method is often applied. However, the bipolar nature of the typical device structure does not allow for strict unipolar operation, and therefore the method does not allow for the separate evaluation of electron and hole traps. The recombination between electrons and holes makes the interpretation of the data difficult, which becomes an essential drawback of this method. To address these issues, we propose the use of a metal insulator semiconductor (MIS) device structure for TSC measurements, which can be operated strictly unipolar by the sign of the applied voltage during the charging process. Thus, the problem of recombination and bipolar contribution to the measurement signal is avoided. As an additional benefit, the MIS device structure typically results in very low leakage currents, and thus a low noise level for the measurement. This permits precise measurements even below 1 pA, and consequently increases the resolution of the method. This aspect is especially important for fractional TSC, as the measurement time is long and the current low when compared to the envelope measurement. Here, we demonstrate the basic principle of this TSC approach, which we name MIS-TSC, using the well-studied organic semiconductor P3HT as a benchmark. Published under license by AIP Publishing.
机译:为了确定半导体中陷阱的状态分布的密度,通常应用热激励电流(TSC)方法。但是,典型器件结构的双极性性质不允许严格的单极性操作,因此该方法不允许单独评估电子和空穴陷阱。电子和空穴之间的复合使数据的解释变得困难,这成为该方法的主要缺点。为了解决这些问题,我们建议使用金属绝缘体半导体(MIS)器件结构进行TSC测量,通过在充电过程中施加的电压符号可以严格单极性操作。因此,避免了重组和对测量信号的双极性贡献的问题。另一个好处是,MIS设备的结构通常会导致非常低的泄漏电流,从而导致测量的噪声水平很低。这样即使在1 pA以下也可以进行精确的测量,从而提高了方法的分辨率。这一点对于分数TSC尤其重要,因为与包络测量相比,测量时间长而电流低。在这里,我们使用经过充分研究的有机半导体P3HT作为基准,论证了这种TSC方法的基本原理,我们将其命名为MIS-TSC。由AIP Publishing授权发布。

著录项

  • 来源
    《Applied Physics Letters》 |2019年第15期|152104.1-152104.5|共5页
  • 作者单位

    Univ Duisburg Essen, Inst Technol Nanostruct, Bismarckstr 81, D-47057 Duisburg, Germany;

    Univ Duisburg Essen, CENIDE, Bismarckstr 81, D-47057 Duisburg, Germany;

    Univ Duisburg Essen, CENIDE, Bismarckstr 81, D-47057 Duisburg, Germany;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

  • 入库时间 2022-08-18 04:12:52

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