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Superconducting properties of MgB_(2) films electroplated to stainless steel substrates

机译:电镀到不锈钢基板上的MgB_(2)薄膜的超导性能

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Superconducting MgB_(2) films have been fabricated on stainless steel substrates by means of electroplating in a molten electrolyte composed of MgCl_(2), MgB_(2)O_(4), NaCl, and KCl containing a fractional amount of CuCl_(2). Microscopic observation has revealed that the electroplated films and substrates are combined with each other through Cu-rich layers at the interfaces. Transport measurements have shown that the electroplated MgB_(2) films possess an upper critical field, H_(c2)(0), of 28 T, an irreversibility field, H_(irr)(0), of 13 T, and a critical current density, J_(c)(5 K,0 T), of 25 000 A/cm~(2), which suggests that the electroplating in molten salts is a promising alternative to the powder-in-tube method for the fabrication of MgB_(2) tapes.
机译:通过在由MgCl_(2),MgB_(2)O_(4),NaCl和含有少量CuCl_(2)的KCl组成的熔融电解质中进行电镀,已在不锈钢基板上制造了超导MgB_(2)膜。 。显微镜观察表明,电镀膜和基板通过界面处的富Cu层相互结合。传输测量表明,电镀的MgB_(2)膜具有28 T的上临界场H_(c2)(0),13 T的不可逆场H_(irr)(0)和临界电流密度J_(c)(5 K,0 T)为25000 A / cm〜(2),这表明在熔融盐中进行电镀是制造MgB_的管内粉末法的有希望的替代方法(2)胶带。

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