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The metallization process on insulating substrate, employing a cylinder of stainless steel, on which is deposited by electroplating, metal desired

机译:在绝缘基板上的金属化工艺,采用不锈钢圆柱体,通过电镀将所需的金属沉积在其上

摘要

The metallization process on insulating substrate, employing a cylinder of stainless steel, on which is deposited by electroplating, metal desired refers to this invention, a process for obtaining metallic foil, coil, from a cylinder of stainless steel, which is in a A horizontal axis within an electrolytic solution of the metal to form the film.The film is removed continuously with the spin of the cylinder of stainless steel.
机译:在绝缘基板上进行金属化的工艺,采用的是不锈钢圆筒,通过电镀在其上淀积所需金属,本发明涉及一种从水平方向为A的不锈钢圆筒中获得金属箔,线圈的方法。在金属的电解溶液中形成一个轴,以形成薄膜。随着不锈钢圆柱体的旋转,薄膜被连续去除。

著录项

  • 公开/公告号BRPI0601739A

    专利类型

  • 公开/公告日2007-12-18

    原文格式PDF

  • 申请/专利权人 ELIANA SILVEIRA;

    申请/专利号BR2006PI01739

  • 发明设计人 ELIANA SILVEIRA;

    申请日2006-04-25

  • 分类号C25D19/00;C25D17/00;

  • 国家 BR

  • 入库时间 2022-08-21 20:08:39

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