Shape-and-solder-directed self-assembly to package semiconductor device segments

摘要

The self-assembly and packaging of integrated semiconductor device segments have been accomplished by combining geometrical shape recognition with site specific wetting and binding involving liquid solder. Components with complementary shapes were fabricated to recognize and encapsulate functional semiconductor devices. The components were suspended in water and agitated using a pulsating liquid flow. Two hundred AlGaN/GaN light-emitting diodes with a chip size of 380x330 micrometers were assembled and packaged with a yield of 95% in 2 min. The self-assembly procedure forms electrical interconnects between three-dimensionally shaped objects and provides a route to parallel assembly of hybrid microsystems. (C) 2004 American Institute of Physics.