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Effects of dielectric structure of HfO_(2) on carrier generation rate in Si substrate and channel mobility

机译:HfO_(2)的介电结构对硅衬底载流子产生速率和沟道迁移率的影响

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摘要

This letter presents the effects of surface preparation for hafnium-based dielectrics on the bulk carrier generation rates and the carrier mobility. Different surface preparations result in different interfacial layers. Nitrogen-incorporated layers effectively block impurity penetration from hafnium oxide, and lead to the increase of bulk carrier generation lifetime. However, nitrogen-incorporated interface layers increase interface state density and degrade channel mobility, even though bulk carrier generation lifetime is increased. Thus, mobility degradation is preliminarily caused by fixed charge and interface states of the high-k dielectrics.
机译:这封信介绍了preparation基电介质表面处理对整体载流子生成速率和载流子迁移率的影响。不同的表面处理会导致不同的界面层。掺氮层有效地阻止了氧化ha对杂质的渗透,并导致了载流子产生寿命的增加。但是,即使增加了载流子的产生寿命,掺氮的界面层也会增加界面态密度并降低沟道迁移率。因此,迁移率降低首先是由高k电介质的固定电荷和界面态引起的。

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