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Electrical characterization of Er- and Pr-implanted GaN films

机译:掺Er和Pr的GaN薄膜的电学表征

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Hall, current-voltage, and deep-level transient spectroscopy measurements were used to characterize the electrical properties of metalorganic chemical vapor deposition grown undoped, Erand Pr-implanted GaN films. Only one deep level located at 0.270 eV below the conduction band was found in the as-grown GaN films. However, four defect levels located at 0.300, 0.188, 0.600, and 0.410 eV below the conduction band were found in the Er-implanted GaN films after annealing at 900℃ for 30 min, and four defect levels located at 0.280, 0.190, 0.610, and 0.390 eV below the conduction band were found in the Pr-implanted GaN films after annealing at 1050℃ for 30 min. The origins of the deep defect levels are discussed.
机译:霍尔,电流电压和深层瞬态光谱测量用于表征未掺杂Erand Pr注入的GaN膜生长的金属有机化学气相沉积的电学特性。在刚生长的GaN薄膜中,仅发现了一个比导带低0.270 eV的深能级。然而,在900℃下退火30分钟后,在掺Er的GaN膜中发现四个缺陷位点分别位于导带以下0.300、0.188、0.600和0.410 eV处,四个缺陷位点分别位于0.280、0.190、0.610和0.210 eV处。在1050℃退火30 min后,掺Pr的GaN薄膜的导带低于导带0.390 eV。讨论了深层缺陷级别的由来。

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