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Annealing-time dependence in interfacial reaction between poly-Si electrode and HfO_2/Si gate stack studied by synchrotron radiation photoemission and x-ray absorption spectroscopy

机译:同步辐射光发射和X射线吸收光谱研究多晶硅电极与HfO_2 / Si栅堆叠界面反应中的退火时间依赖性

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We have investigated annealing-time dependence in interfacial reactions between polycrystalline-Si (poly-Si) electrodes and HfO_2/Si gate stacks using synchrotron radiation photoemission and x-ray absorption spectroscopy. From photoemission core-level spectra, we found that silicidation started at the upper interface between poly-Si electrodes and HfO_2 gate dielectrics under the conditions of 700℃ and 3 min in ultrahigh vacuum. Before silicidation, we observed nonstoichiometric silicon oxide at the upper interface, suggesting the formation of oxygen vacancies which may cause Fermi level pinning. The interface layer between HfO_2 gate dielectrics and Si substrates was changed into silicide by further annealing. In addition, from valence-band photoemission and O K-edge absorption spectra, we have found that the crystallization of HfO_2 gate dielectrics is independent of silicidation.
机译:我们已经使用同步加速器辐射光发射和X射线吸收光谱研究了多晶硅电极和HfO_2 / Si栅堆叠之间的界面反应中的退火时间依赖性。从光发射核心能级光谱中,我们发现硅化作用是在700℃和3分钟的超高真空条件下,在多晶硅电极和HfO_2栅极电介质之间的上界面开始的。在硅化之前,我们在上界面观察到非化学计量的氧化硅,表明氧空位的形成可能导致费米能级钉扎。通过进一步退火,HfO_2栅极电介质和Si衬底之间的界面层变成了硅化物。此外,从价带光发射和O K边缘吸收光谱中,我们发现HfO_2栅极电介质的结晶与硅化无关。

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