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首页> 外文期刊>Applied Physics Letters >Large-area patterning of a solution-processable organic semiconductor to reduce parasitic leakage and off currents in thin-film transistors
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Large-area patterning of a solution-processable organic semiconductor to reduce parasitic leakage and off currents in thin-film transistors

机译:可溶液处理的有机半导体的大面积构图,以减少薄膜晶体管中的寄生泄漏和截止电流

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摘要

We describe two techniques for patterning spin-cast thin films of a solution-processable organic semiconductor, triethylsilylethylnyl anthradithiophene (TES ADT), to eliminate parasitic leakage currents and to lower off currents in thin-film transistors. One technique utilizes UV light in the presence of solvent vapors to simultaneously define the active channel and to crystallize TES ADT. The second technique selectively removes TES ADT from the nonchannel regions of the thin-film transistors through direct contact with a poly(dimethylsiloxane) stamp. Both patterning techniques yield thin-film transistors with high charge-carrier mobility ( ≥ 0.1 cm~2/V s), low off currents (10~(-10)-10~(-11) A), and minimal parasitic leakage.
机译:我们描述了两种用于对可溶液处理的有机半导体的自旋流延薄膜进行构图的技术,即三乙基甲硅烷基乙炔基噻吩(TES ADT),以消除寄生泄漏电流并降低薄膜晶体管中的截止电流。一种技术是在存在溶剂蒸气的情况下利用紫外线来同时定义有效通道并结晶TES ADT。第二种技术是通过直接与聚(二甲基硅氧烷)压模接触,从薄膜晶体管的非沟道区选择性去除TES ADT。两种图案化技术都可产生具有高载流子迁移率(≥0.1 cm〜2 / V s),低截止电流(10〜(-10)-10〜(-11)A)且寄生泄漏最少的薄膜晶体管。

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