首页> 外文期刊>Applied Physics Letters >Flux pinning in YBa_2Cu_3O_(7-δ) thin film samples linked to stacking fault density
【24h】

Flux pinning in YBa_2Cu_3O_(7-δ) thin film samples linked to stacking fault density

机译:与堆叠缺陷密度相关的YBa_2Cu_3O_(7-δ)薄膜样品中的助焊剂钉扎

获取原文
获取原文并翻译 | 示例
       

摘要

In this paper, we report a strong correlation between the stacking fault (SF) density and the critical current density of YBa_2Cu_3O_(7-δ) (YBCO) thin films in applied field (J_c~(in-field)). We found that the J_c~(in-field)(H‖c) increases as a clear linear dependence of the density of SF identified in the as-grown samples deposited on both SrTiO_3 (STO) and LaAlO_3 substrates. Detailed microstructural studies including cross-section transmission electron microscopy (TEM) and high resolution TEM were conducted for all the films deposited on STO substrates. This work suggests that the YBCO SF density plays an important role in the YBCO in-field transport performance.
机译:在本文中,我们报道了YBa_2Cu_3O_(7-δ)(YBCO)薄膜在应用领域(J_c〜(in-field))中的堆垛层错(SF)密度与临界电流密度之间有很强的相关性。我们发现,随着沉积在SrTiO_3(STO)和LaAlO_3衬底上的成长期样品中所确定的SF密度的明显线性依赖性,J_c〜(场内)(H′c)增大。对沉积在STO基板上的所有薄膜进行了详细的微观结构研究,包括截面透射电子显微镜(TEM)和高分辨率TEM。这项工作表明,YBCO SF密度在YBCO现场运输性能中起着重要作用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号