机译:Si / SiC键合晶片:在SiC上实现无碳SiO_2的途径
School of Engineering, University of Warwick, Coventry CV4 7AL, United Kingdom IMB-CNM-CSIC, Campus UAB, 08193 Barcelona, Spain;
School of Engineering, Swansea University, Singleton Park, Swansea SA2 8PP, United Kingdom;
School of Engineering, Swansea University, Singleton Park, Swansea SA2 8PP, United Kingdom;
School of Engineering, University of Warwick, Coventry CV4 7AL, United Kingdom;
IMB-CNM-CSIC, Campus UAB, 08193 Barcelona, Spain;
IMB-CNM-CSIC, Campus UAB, 08193 Barcelona, Spain;
School of Engineering, University of Warwick, Coventry CV4 7AL, United Kingdom;
School of Engineering, University of Warwick, Coventry CV4 7AL, United Kingdom;
School of Engineering, University of Warwick, Coventry CV4 7AL, United Kingdom;
Department of Physics, University of Warwick, Coventry CV4 7AL, United Kingdom;
School of Engineering, University of Warwick, Coventry CV4 7AL, United Kingdom;
机译:弯曲4“直径3C-SiC外膜形成在晶片键合的Si / SiC基材上
机译:现实温度下SiC(0001)/ SiO_2系统中碳缺陷的结构和能量学:SiC,SiO_2和界面的缺陷
机译:晶圆相对旋转度对键合SiC / SiC界面电性能的影响
机译:在多晶SiC晶圆键合衬底上使用硅开发3C-SiC SOI结构
机译:通过溶胶-凝胶和原位聚合技术从多层涂覆的SiC颗粒制备莫来石键合多孔SiC陶瓷。
机译:全SiC电容式压力传感器常温下SiC-AlN的晶片键合
机译:Si / SiC键合晶圆:在SiC \ ud上实现无碳SiO2的途径