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首页> 外文期刊>Applied Physics Letters >Improvement in the leakage current characteristic of metal-insulator-metal capacitor by adopting RuO_2 film as bottom electrode
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Improvement in the leakage current characteristic of metal-insulator-metal capacitor by adopting RuO_2 film as bottom electrode

机译:以RuO_2膜为底电极改善金属-绝缘-金属电容器的漏电流特性

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摘要

The dielectric constant, equivalent oxide thickness (t_(ox)), and leakage current properties of Pt/(Al-doped)TiO_2/RuO_2 capacitors were examined in comparison with Pt/(Al-doped)TiO_2/Ru capacitors. The Al-doped TiO_2 and undoped TiO_2 films grown on RuO_2 showed high dielectric constants of 60 and 102, respectively. The minimum t_(ox) of these films were 0.46 nm and 0.56 nm, respectively, while still satisfying the dynamic random access memory leakage current density specification (< 1 x 10~(-7) Acm~(-2) at capacitor voltage of 0.8 V). These excellent electrical properties of (Al-doped) TiO_2 on RuO_2 were attributed to the high work function and the reduced interfacial effect on RuO_2.
机译:与Pt /(Al掺杂)TiO_2 / Ru电容器相比,研究了Pt /(Al掺杂)TiO_2 / RuO_2电容器的介电常数,等效氧化物厚度(t_(ox))和漏电流特性。在RuO_2上生长的Al掺杂的TiO_2和未掺杂的TiO_2薄膜分别具有60和102的高介电常数。这些薄膜的最小t_(ox)分别为0.46 nm和0.56 nm,同时仍满足动态随机存取存储器泄漏电流密度规格(<1 x 10〜(-7)Acm〜(-2)的电容器电压)。 0.8 V)。 (Al掺杂)TiO_2在RuO_2上的优异电学性能归因于其较高的功函和对RuO_2界面作用的降低。

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  • 来源
    《Applied Physics Letters》 |2011年第2期|p.022901.1-022901.3|共3页
  • 作者单位

    WCU hybrid materials program, Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 151-744, Korea;

    WCU hybrid materials program, Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 151-744, Korea;

    WCU hybrid materials program, Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 151-744, Korea;

    WCU hybrid materials program, Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 151-744, Korea;

    WCU hybrid materials program, Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 151-744, Korea;

    Air Liquide, 28 Wadai, Tsukuba-Shi, Ibaraki Pref., 300-4247, Japan;

    Air Liquide, 28 Wadai, Tsukuba-Shi, Ibaraki Pref., 300-4247, Japan;

    WCU hybrid materials program, Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 151-744, Korea;

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