机译:通过将Ge掺入氧化硅膜中进行隧道电流调制,以用于闪存应用
Corporate Research and Development Center, Toshiba Corporation, Saiwai-ku, Kawasaki 212-8582, Japan;
Corporate Research and Development Center, Toshiba Corporation, Saiwai-ku, Kawasaki 212-8582, Japan;
Corporate Research and Development Center, Toshiba Corporation, Saiwai-ku, Kawasaki 212-8582, Japan;
Corporate Research and Development Center, Toshiba Corporation, Saiwai-ku, Kawasaki 212-8582, Japan;
Corporate Manufacturing Engineering Center, Toshiba Corporation, Isogo-ku, Yokohama 235-0017, Japan;
Corporate Manufacturing Engineering Center, Toshiba Corporation, Isogo-ku, Yokohama 235-0017, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,Isogo-ku, Yokohama 235-8522, Japan;
Device Process Development Center, Corporate Research and Development Center, Toshiba Corporation,Isogo-ku, Yokohama 235-8522, Japan;
机译:Nh_3退火湿氧化化学气相沉积Sio_2单层薄膜在隧穿快闪记忆体氧化物中的应用
机译:201C的电气和可靠性研究;湿$ hbox {N} _ {2} hbox {O} $ 201D;硅上生长的隧道氧化物,用于闪存应用
机译:通过在闪存应用中采用Si_3N_4 / SiO_2 / Si_3N_4多层来改善隧道电介质的电流-电压特性
机译:闪存应用中氮结合再氧化隧道氧化物的开发和优化
机译:钇钡氧化铜薄膜和超导隧道结的内在无序效应和持续电流研究。
机译:HfO2 / SiO2叠层隧道电介质的SiN薄膜中离子注入能量对Ge纳米晶体合成的影响
机译:硅上生长的用于闪存应用的“湿$ N_2O $”隧道氧化物的电学和可靠性研究
机译:利用光谱椭偏仪和离子散射及反射光谱法对复合氧化物薄膜中氧的掺入进行原位实时研究