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Polarization of Bi_2Te_3 thin film in a floating-gate capacitor structure

机译:浮栅电容器结构中Bi_2Te_3薄膜的极化

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摘要

Metal-Oxide-Semiconductor (MOS) capacitors with Bi_2Te_3 thin film sandwiched and embedded inside the oxide layer have been fabricated and studied. The capacitors exhibit ferroelectric-like hysteresis which is a result of the robust, reversible polarization of the Bi_2Te_3 thin film while the gate voltage sweeps. The temperature-dependent capacitance measurement indicates that the activation energy is about 0.33 eV for separating the electron and hole pairs in the bulk of Bi_2Te_3, and driving them to either the top or bottom surface of the thin film. Because of the fast polarization speed, potentially excellent endurance, and the complementary metal-oxide-semiconductor compatibility, the Bi_2Te_3 embedded MOS structures are very interesting for memory application.
机译:制备并研究了Bi_2Te_3薄膜夹在氧化物层内的金属氧化物半导体(MOS)电容器。电容器表现出类似铁电体的磁滞现象,这是由于在栅极电压扫描时Bi_2Te_3薄膜的坚固,可逆极化的结果。与温度有关的电容测量结果表明,活化能约为0.33 eV,用于分离大部分Bi_2Te_3中的电子对和空穴对,并将其驱动至薄膜的上表面或下表面。由于快速的极化速度,潜在的出色耐久性和互补的金属氧化物半导体兼容性,Bi_2Te_3嵌入式MOS结构对于存储器应用非常有趣。

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  • 来源
    《Applied Physics Letters》 |2014年第23期|233505.1-233505.5|共5页
  • 作者单位

    Department of Electrical and Computer Engineering, George Mason University, Fairfax, Virginia 22030,USA,Semiconductor and Dimensional Metrology Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8120, USA;

    Department of Electrical and Computer Engineering, Old Dominion University, Norfolk, Virginia 23529,USA;

    Department of Electrical and Computer Engineering, George Mason University, Fairfax, Virginia 22030,USA,Semiconductor and Dimensional Metrology Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8120, USA;

    Department of Electrical and Computer Engineering, George Mason University, Fairfax, Virginia 22030,USA,Semiconductor and Dimensional Metrology Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8120, USA;

    Materials Science and Engineering Division, National Institute of Standards and Technology,Gaithersburg, Maryland 20899, USA;

    Department of Electrical and Computer Engineering, Old Dominion University, Norfolk, Virginia 23529,USA;

    Semiconductor and Dimensional Metrology Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899-8120, USA;

    Department of Electrical and Computer Engineering, George Mason University, Fairfax, Virginia 22030,USA;

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