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Bottom-gate coplanar graphene transistors with enhanced graphene adhesion on atomic layer deposition Al_2O_3

机译:在原子层沉积Al_2O_3上具有增强的石墨烯附着力的底栅共面石墨烯晶体管

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摘要

A graphene transistor with a bottom-gate coplanar structure and an atomic layer deposition (ALD) aluminum oxide (Al_2O_3) gate dielectric is demonstrated. Wetting properties of ALD Al_2O_3 under different deposition conditions are investigated by measuring the surface contact angle. It is observed that the relatively hydrophobic surface is suitable for adhesion between graphene and ALD Al_2O_3. To achieve hydrophobic surface of ALD Al_2O_3, a methyl group (CH_3)-terminated deposition method has been developed and compared with a hydroxyl group (OH)-terminated deposition. Based on this approach, bottom-gate coplanar graphene field-effect transistors are fabricated and characterized. A post-thermal annealing process improves the performance of the transistors by enhancing the contacts between the source/drain metal and graphene. The fabricated transistor shows an I_(on)/I_(off) ratio, maximum transconductance, and field-effect mobility of 4.04, 20.1 μS at V_D = 0.1 V, and 249.5 cm~2/V•s, respectively.
机译:说明了具有底栅共面结构和原子层沉积(ALD)氧化铝(Al_2O_3)栅电介质的石墨烯晶体管。通过测量表面接触角,研究了不同沉积条件下ALD Al_2O_3的润湿性能。观察到相对疏水的表面适合于石墨烯和ALD Al_2O_3之间的粘附。为了获得ALD Al_2O_3的疏水表面,已经开发了甲基(CH_3)终止的沉积方法,并将其与羟基(OH)终止的沉积进行了比较。基于这种方法,制造并表征了底栅共面石墨烯场效应晶体管。后热退火工艺通过增强源极/漏极金属和石墨烯之间的接触来改善晶体管的性能。制成的晶体管的I_(on)/ I_(off)比,最大跨导和场效应迁移率分别为4.04,在V_D = 0.1 V时为20.1μS和249.5 cm〜2 / V•s。

著录项

  • 来源
    《Applied Physics Letters》 |2015年第10期|102106.1-102106.5|共5页
  • 作者单位

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;

    Department of Biomedical Engineering, and Wisconsin Institute for Discovery, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;

    Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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