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机译:铯离子注入对有机硅低k薄膜机械和电学性能的影响
Plasma Processing and Technology Laboratory, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;
Plasma Processing and Technology Laboratory, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;
Plasma Processing and Technology Laboratory, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;
Plasma Processing and Technology Laboratory, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;
Plasma Processing and Technology Laboratory, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;
IBM TJ. Watson Research Center, Yorktown Heights, New York 10598, USA;
Intel Corporation, Hillsboro, Oregon 97124, USA;
Plasma Processing and Technology Laboratory, Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, Wisconsin 53706, USA;
机译:含氧量对低k有机硅玻璃介电薄膜键合结构和性能的影响
机译:等离子体和真空紫外线照射对低k多孔有机硅酸盐玻璃机械性能的影响
机译:基于自组装的有机硅酸盐多孔膜的机电性能研究
机译:紫外线固化对有机硅低k薄膜的玻璃结构和力学性能的影响
机译:真空紫外线辐照对多孔低k有机硅玻璃的电性能的影响。
机译:具有增强的机械和电气性能的纸状石墨烯-Ag复合膜
机译:甲基末端和碳桥接基团比率对多孔有机硅酸盐玻璃膜的关键特性的影响